Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1991-09-30
1993-03-02
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
361412, 257723, H01L 2512, H01L 2516, H01L 2312
Patent
active
051914042
ABSTRACT:
A low-profile, high-density package for intergrated circuit chips is provided. A first multichip memory module includes first and second interconnect members having low-profile memory chips mounted on a first side of each member. Low-profile edge clips are employed to mechanically connect a second side of the second member to a second side of the first member, and to electrically connect the first sides of the members to a first surface of a circuit board. Likewise, a second multichip memory module includes first and second interconnect members having low-profile memory chips mounted to a first side of each member. Low-profile edge clips are employed to mechanically connect the second sides of the members, and to electrically connect the first sides of the members to a second surface of the circuit board. A thermal management technique that distributes thermal loads is thereafter applied to create a high-density package capable of insertion into a standard computer backplane and cabinet.
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Bruce, II E. William
O'Dea John
Smelser Donald W.
Wu Andrew L.
Clark S. V.
Digital Equipment Corporation
Hille Rolf
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