Method and apparatus for removing components bonded to a substra

Details Method and apparatus for removing components bonded to a substra Method and apparatus for removing components bonded to a substra

1991-01-23

1992-10-13

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156229, 156584, 228264, B32B 3100

Patent

active

051547937

ABSTRACT:
A method of removing components bonded to a substrate without damaging either the component-to-be-removed or adjacent components involves bonding a lifting member to an exposed surface of a component-to-be-removed with a bonding layer whose yielding temperature is above the yielding temperature of the bonding layer which bonds the component-to-be-removed to the substrate and then pulling the lifting member under conditions which cause the bond between the component and the substrate to yield. This component removal process enables post removal failure analysis to be performed on a faulty component and also allows a removed good component to be reused by preventing damage to the component being removed.

REFERENCES:
patent: 3094323 (1963-06-01), Catania
patent: 3279969 (1966-10-01), Borchardt
patent: 4004061 (1977-01-01), Creighton et al.
patent: 4398985 (1983-08-01), Eagon
patent: 4436242 (1984-03-01), Shisler et al.
patent: 4517235 (1985-05-01), Ungar et al.
patent: 4664739 (1987-05-01), Aurichio
patent: 4759816 (1988-07-01), Kasper et al.
patent: 4775438 (1988-10-01), Funakoshi et al.

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