Heat shock resistant printed circuit board assemblies

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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427 97, 427 98, 428901, H05K 109

Patent

active

043037984

ABSTRACT:
The heat shock resistance of plated through holes in printed circuit assemblies is significantly increased by using as the through hole plating a special multi-layered arrangement comprising at least two layers of an electrically conductive metal in combination with at least one intermediate layer of a different electrically conductive metal. In preferred embodiments, the through hole plating comprises at least two layers of a stressed metal together with at least one intermediate layer of a metal having a stress in counteraction to that of one or more of the other metal layers. These through hole platings are capable of exposure to conditions of heat shock, such as encountered during high temperature soldering, without developing cracks resulting in breaks in the conducting pathways and failures.

REFERENCES:
patent: 3514538 (1970-05-01), Chadwick
patent: 3959523 (1976-05-01), Grunwald
patent: 4047290 (1977-09-01), Weitze
patent: 4104111 (1978-08-01), Mack
"Encapsulayer," Photocircuits Corp., Technical Bulletin, 2 pp., Glen Cove, N.Y.
Haddad et al., Printed Circuits With Diverse Metallic Topography, IBM Tech. Bull., vol. 13 #1, Jun. 1970 pp. 124 & 125. _

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