Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-11-03
1998-03-10
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
257678, 437214, 439 73, H05K 334
Patent
active
057247285
ABSTRACT:
A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.
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Bond Robert H.
Siegel Harry M.
Arbes Carl J.
Galanthay Theodore E.
Jorgenson Lisa K.
Regan Christopher F.
SGS-Thomson Microelectronics Inc.
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