Etching method for forming a lead frame

Details Etching method for forming a lead frame Etching method for forming a lead frame

1995-01-13

1996-01-09

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29884, 216 14, H01R 4300

Patent

active

054817986

ABSTRACT:
A lead frame capable of easily connecting an inner lead to an electrode of a semiconductor element by way of a bump of the inner lead, and a method of manufacturing the lead frame capable of significantly easily forming the bump. A bump forming metal layer is formed on a metal base sheet on an area where each inner lead is to be formed. The inner lead is formed on the bump forming metal layer, and the bump forming metal layer is etched using the inner lead as a mask, thus forming a bump. After that, each outer lead is formed by selective etching of the metal base sheet from the rear surface side.

REFERENCES:
patent: 3773628 (1973-11-01), Misawa et al.
patent: 4511429 (1985-04-01), Mizsutani et al.
patent: 4878990 (1989-11-01), Dugan et al.
patent: 5221428 (1993-06-01), Ohsawa et al.

Affiliated with

Also associated with

Rating

Etching method for forming a lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etching method for forming a lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etching method for forming a lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1295424