Method of manufacturing organic substrate used for printed circu

Details Method of manufacturing organic substrate used for printed circu Method of manufacturing organic substrate used for printed circu

1994-06-10

1996-01-09

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 29830, 174264, 428901, H01K 310

Patent

active

054817951

ABSTRACT:
A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

REFERENCES:
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4857381 (1989-08-01), Suzuki
patent: 4895756 (1990-01-01), Suzuki
patent: 5035939 (1991-07-01), Conlon
patent: 5047283 (1991-09-01), Leatherman et al.
patent: 5049435 (1991-09-01), Uno et al.
patent: 5117069 (1992-05-01), Higgins, III
Patent Abstracts of Japan; vol. 013, No. 230 (E-764) 26 May 1989; & JPA-1-01 037 079 (Shin Kobe Electric Mach Co) 7 Feb. 1989, abstract.
Patent Abstracts of Japan; vol. 015, No. 179 (E-1064) 8 May 1991; & JPA-03 041 794 (Casio Comput Co) 22 Feb. 1991; abstract.

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