Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – Frame
Patent
1996-07-22
1998-09-08
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
Frame
361704, H02B 101, H02B 720
Patent
active
058054308
ABSTRACT:
A heat sink is placed in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package, without imparting stressful forces to the substrate by connecting the heat sink to a frame which is connected to a support such as a printed circuit board or other suitable carrier on which the substrate is positioned. The heat sink extends through an aperture in the frame and is in heat transfer relationship with a surface of the substrate; however, it is mechanically decoupled from the substrate. The invention has particular application in thermally connecting large heat sinks to substrates that are surface mounted on the support using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. In order to provide intimate contact between the substrate and the heat sink, the heat sink must be depressed coaxially through the aperture of the frame against a surface of the substrate and then secured by, for example, gluing while in contact with the surface. However, this downward force imparted by the heat sink is quickly reduced via relaxation of the lead/tin or other metallic elements of the surface mount.
A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matches the thermal expansion of the substrate. Thus the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.
REFERENCES:
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patent: 5311402 (1994-05-01), Kobayashi et al.
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Heatsink attachment for Improved Electromagnetic Compatability and Shock Performance. IBM Technical Disclosure Bulletin, vol. 38, No. 03 Mar. 1995, pp. 383-386.
Atwood Eugene R.
Benenati Joseph A.
Dankelman James J.
Kastberg Eric J.
Puttlitz Karl J.
International Business Machines - Corporation
Soucar Steven J.
Thompson Gregory D.
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