Microelectronic assemblies including Z-axis conductive films

Details Microelectronic assemblies including Z-axis conductive films Microelectronic assemblies including Z-axis conductive films

1996-09-24

1998-09-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257703, 257720, 439 66, 439 91, 361783, 361773, 361774, 361776, H05K 114

Patent

active

058054251

ABSTRACT:
First and second electronic parts interconnected by a nonconductive nanoporous film having first and second parallel surfaces, said film having metal-filled pores extending through the thickness of the film, such that each of said parts is contacted by the metal in at least several pores, a number of the pores being perpendicular to the surfaces of the film, and other pores being oblique to the surfaces of the film, whereby thermal dissipation is enhanced in the plane of the film.

REFERENCES:
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5286417 (1994-02-01), Mahmoud et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5543949 (1996-08-01), Machida et al.
patent: 5613862 (1997-03-01), Naylor
IBM Technical Disclosure Bulletin vol. 30, No. 9, Feb. 1988.

Affiliated with

Also associated with

Rating

Microelectronic assemblies including Z-axis conductive films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic assemblies including Z-axis conductive films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic assemblies including Z-axis conductive films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1288909