Microelectronic assemblies including Z-axis conductive films

Details Microelectronic assemblies including Z-axis conductive films Microelectronic assemblies including Z-axis conductive films

1996-09-24

1998-09-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361765, 361777, 361783, 439 66, 439 91, 257703, 257720, H01L 2700

Patent

active

058054243

ABSTRACT:
First and second electronic parts interconnected by a nonconductive nanoporous film, said film having metal-filled pores extending through the thickness of the film, such that each of said devices is contacted by the metal in at least several pores, wherein said film comprises liquid crystal or rigid rod polymer films.

REFERENCES:
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5286417 (1994-02-01), Mahmoud et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5470693 (1995-11-01), Sachdev et al.
patent: 5543949 (1996-08-01), Machida et al.
patent: 5613862 (1997-03-01), Naylor
IBM Technical Disclosure Bulletin vol. 30, No. 9, Feb. 1988.

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