Plastic and nonmetallic article shaping or treating: processes – Optical article shaping or treating – Utilizing plasma – electric – electromagnetic – particulate – or...
Patent
1981-11-27
1983-10-18
Lowe, James B.
Plastic and nonmetallic article shaping or treating: processes
Optical article shaping or treating
Utilizing plasma, electric, electromagnetic, particulate, or...
29569L, 29588, 26427215, 26427216, 26427217, 350 9617, 350 962, 357 72, G02B 5174
Patent
active
044104693
ABSTRACT:
In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which have a common central axis and one of which defines an optical path of the module, in such a manner that the optoelectronic element is located on a central axis of the circuit module. Under this condition, the circuit module is housed in a cavity defined by a pair of second dies. A light-shielding molding material is injected into the cavity for injection molding to mold a case. After the case is cured, the first and second dies are removed, and the hole of the case formed by one of the first die is closed with a cap to complete a receptacle.
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patent: 4216577 (1980-08-01), Badet et al.
patent: 4305204 (1981-12-01), Toggart et al.
"Transfer Molding--Past, Present, and Future," Hull, SPE Journal, Jan. 1962, pp. 87-89.
"Module Package," Dion et al., IBM Technical Disclosure Bulletin, vol. 7, No. 7, Dec. 64, p. 557.
Donuma Kenichi
Katagiri Shuhei
Ohashi Makoto
Lowe James B.
Tokyo Shibaura Denki Kabushiki Kaisha
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