Method of mounting electric part onto a substrate

Details Method of mounting electric part onto a substrate Method of mounting electric part onto a substrate

1982-05-28

1985-03-26

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

2281801, H05K 334

Patent

active

045064431

ABSTRACT:
A chip mounting substrate which comprises inserting holes formed in a substrate for inserting chips in, a sheet provided on the top surface of the substrate to cover the holes and having adhesivity on the inner surface covering the holes, and wiring pattern provided on the back surface of the substrate so as to be associated with electrode portions of the chips inserted in the inserting holes, so that after inserting the chips in the inserting holes to thereby temporarily adhere and fix them by the sheet, the electrode portion of each chip and the associated wiring pattern are soldered and connected together.

REFERENCES:
patent: 3966110 (1976-06-01), Boynton
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4215025 (1980-07-01), Packer et al.
patent: 4226659 (1980-10-01), Griffith et al.
patent: 4312692 (1982-01-01), Ikeda et al.
patent: 4314870 (1982-02-01), Ishida et al.

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