Method for production of semiconductor devices

Details Method for production of semiconductor devices Method for production of semiconductor devices

1982-09-03

1985-03-26

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29576W, 148 15, 148175, 148187, 156643, 156648, 156662, 357 49, H01L 2176, H01L 21302, H01L 2120

Patent

active

045064342

ABSTRACT:
A method for producing semiconductor devices having a substrate, element fabrication areas formed in the substrate and isolation areas surrounding the element fabrication areas. The method comprises forming a thermal strain absorbing layer on the top surface of the element fabrication areas, forming at least one groove in an area which is to become the isolation areas, inlaying an insulator in the at least one groove, and annealing the insulator to make the density thereof uniform.

REFERENCES:
patent: 3421055 (1969-01-01), Bean et al.
patent: 3719535 (1973-03-01), Zoroglu
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4192059 (1980-03-01), Khan et al.
patent: 4209349 (1980-01-01), Ho et al.
patent: 4209350 (1980-06-01), Ho et al.
patent: 4252582 (1981-02-01), Anantha et al.
patent: 4261763 (1981-04-01), Kumar et al.
patent: 4385433 (1983-05-01), Ozawa
patent: 4391650 (1983-07-01), Pfeifer et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 8, Jan. 1981, New York, D. W. Ormond, pp. 3694-3697.
IBM Technical Disclosure Bulletin, vol. 21, No. 7, Dec. 1978, New York, H. B. Pogge, pp. 2734-2735.
IBM Technical Disclosure Bulletin, Abbas et al., "Simplified Isolation for an Integrated Circuit", vol. 25, No. 12, May 1983, pp. 6611-6614.

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