Method of forming expanded pad structure

Details Method of forming expanded pad structure Method of forming expanded pad structure

1982-07-26

1984-01-24

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 89, 427 93, 427123, B05D 512

Patent

active

044277156

ABSTRACT:
A pad for connecting electrical chips in microelectronic circuits includes a passive protective layer overlapping the edge thereof and a bump built up on the connecting pad that had a dimension of the base that is less than that of the pad to prevent the bump from overlapping the edges of the pad and damaging or cracking the underlying structure of the chip during thermocompression bonding of leads to the bump.

REFERENCES:
patent: 4099318 (1978-07-01), Cooper et al.
patent: 4182781 (1980-01-01), Hooper et al.
patent: 4258382 (1981-03-01), Harris

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