Module mounting assembly

Geometrical instruments

Patent

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Details

339 75M, H01R 909

Patent

active

044102232

ABSTRACT:
Apparatus for mounting an integrated circuit module (2) on a printed wiring circuit board (3). The apparatus assembly (1) comprises electrical conducting members (10) for interconnecting the module with the circuit board and an insulating base (11) transversely mounting the electrical conducting members to position quadrilateral configurations of first and second spring contacts (102, 105) in planes parallel to top and bottom surfaces of the insulating base. A one piece cover (12, 42) engages the insulating base to spring clamp the module thereon and maintain each module terminal (20) in electrical engagement with a corresponding one of the first and second spring contacts.

REFERENCES:
patent: 3043021 (1962-07-01), Thompson
patent: 3290636 (1966-12-01), Overtveld
patent: 3805212 (1974-04-01), Landman et al.
patent: 4050755 (1977-09-01), Hasircoglu
patent: 4130327 (1978-12-01), Spaulding
patent: 4142287 (1979-03-01), Grabbe
patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4222622 (1980-09-01), Griffin et al.
patent: 4341433 (1982-07-01), Cherian et al.

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