Platinum and platinum alloy electroplating baths and processes

Details Platinum and platinum alloy electroplating baths and processes Platinum and platinum alloy electroplating baths and processes

1981-11-16

1984-01-24

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 43N, 204 47, C25D 352, C25D 356

Patent

active

044275021

ABSTRACT:
A procedure is described for electroplating platinum and platinum alloys. This procedure permits rapid electroplating of platinum and yields platinum films with excellent properties. The electroplating bath comprises a unique platinum complexing agent, namely an organic polyamine compound. The procedure is also useful for electroplating a variety of platinum alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

REFERENCES:
patent: 2355070 (1944-08-01), Harford
patent: 2384300 (1945-09-01), Harford
patent: 4153523 (1979-05-01), Koontz et al.
patent: 4230538 (1980-10-01), Turner
A. Brenner, "Electrodeposition of Alloys", vol. II, pp. 542-546, (1963).
F. A. Lowenheim, "Electroplating", pp. 298-300, (1978).
Edward A. Parker, Metal Finishing, vol. 79, No. 1A, pp. 305-306, (1981).
W. Keitel et al., Trans. Electrochem, Soc., vol. 59, p. 273, (1931).

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