Multiple integrated circuit module which simplifies handling and

Details Multiple integrated circuit module which simplifies handling and Multiple integrated circuit module which simplifies handling and

1991-11-21

1993-03-30

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361387, 361388, 361400, 361396, 257737, 257777, H05K 720

Patent

active

051989638

ABSTRACT:
A multi-chip module (26) used to interconnect and house a plurality of integrated circuits (10). The module (26) employs an intermediate structure referred to, herein, as a bridge chip (12). The bridge chip (12) connects the integrated circuit (10) to the module substrate (19). The integrated circuit (10) is attached to the bridge chip (12) and forms a composite structure (18) which can be burned-in and tested as an individual unit. The bridge chip (12) has interconnects to bring out the inputs and outputs of the integrated circuit (10). The composite structure (18) is mounted to the module substrate (19) such that, the integrated circuit (10) has a thermal pathway to the module substrate (19), and the bridge chip (12) connects to the module substrate (19). The module substrate (19) has interconnects to connect the plurality of composite structures (18).

REFERENCES:
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 4744008 (1988-05-01), Black et al.
patent: 5049978 (1991-09-01), Bates et al.
Larnerd "IC Pakage Assembly", IBM Tech. Disclosure Bulletin, vol. 20, No. 12, May 1978 pp. 5142-5143.

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