Process for manufacturing miniaturized electronic power circuits

Metal working – Method of mechanical manufacture – Electrical device making

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29589, 357 81, 427 96, H05K 334

Patent

active

046177299

ABSTRACT:
Process for manufacturing miniaturized electronic power circuits comprising power elements soldered to a conducting network with interpositioning of an insulating layer on a good heat conducting metal plate. A substrate is formed by depositing on the metal plate an insulating layer coated outwardly with a good conducting metal layer, and conducting networks are formed from this metal layer, hard soldering paste being deposited at the positions of the connections to be hard soldered to the terminals of the components as well as at the positions where the bodies of the components are to be hard soldered to the layer, the components being laid flat on the substrate so that the terminals are in contact with the hard soldering paste, and are hard soldered in the vapor phase, the circuit obtained then being placed in a sealed case.

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patent: 3899379 (1975-08-01), Wanesky
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patent: 4412377 (1983-11-01), Nagashima et al.
patent: 4459607 (1984-07-01), Reid
patent: 4474639 (1984-10-01), Fritz
patent: 4480779 (1984-11-01), Lue

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