Molding apparatus for enclosing semiconductor chips with resin

Details Molding apparatus for enclosing semiconductor chips with resin Molding apparatus for enclosing semiconductor chips with resin

1985-11-12

1988-02-09

Hoag, Willard E.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

264 405, 26427213, 425129R, 425149, 425544, B29C 3106

Patent

active

047238992

ABSTRACT:
A molding apparatus for enclosing semiconductor chips with resin has a plurality of plungers for applying pressure to a resin material, at least one transfer channel holding each of resin material supplying pots in communication with corresponding one of cavities for transferring the resin material in a molten state, a communication bore formed in the vicinity of the transfer channel in communication therewith, slide members each intimately fitting in the communication bore and slidable forward or backward, pressing-pushing members for pushing each slide member toward the corresponding transfer channel with a uniform pressure, and a pressure sensor operable by the retraction of each slide member for detecting the internal pressure of the transfer channel.

REFERENCES:
patent: 3052918 (1962-09-01), Holmes
patent: 3443628 (1969-05-01), Carr
patent: 4347211 (1982-08-01), Bandoh
patent: 4470786 (1984-09-01), Sano et al.
patent: 4511317 (1985-04-01), Bandoh
patent: 4599062 (1986-07-01), Konishi
patent: 4632653 (1986-12-01), Plocher

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