Coating apparatus – Gas or vapor deposition – With treating means
Patent
1986-04-08
1988-02-09
Kittle, John E.
Coating apparatus
Gas or vapor deposition
With treating means
118728, 427 38, C23C 1650
Patent
active
047235080
ABSTRACT:
A plasma CVD apparatus including a reaction chamber; a pair of electrodes disposed in the reaction chamber between which plasma discharge occurs; a substrate support maintained at a reference voltage; a vacuum pump for evacuating the reaction chamber; a first voltage supply for supplying a first alternating voltage to one of the electrodes; and a second voltage supply for supplying a second alternating voltage to the other of the electrodes where the second alternating voltage is out-of-phase with respect to the first alternating voltage.
REFERENCES:
patent: 4287851 (1981-09-01), Dozier
patent: 4328646 (1982-05-01), Kaganowicz
patent: 4582720 (1986-04-01), Yamazaki
patent: 4593644 (1986-06-01), Hanak
Rand, Myron J., "Plasma-Promoted Deposition of Thin Inorganic Films", J. Vac. Sci. Technol., vol. 16, No. 2 (Mar./Apr. 1979) pp. 420-427.
Inushima Takashi
Miyazaki Minoru
Sakama Mitsunori
Yamazaki Shunpei
Ferguson Jr. Gerald J.
Foycik, Jr. Michael J.
Hoffman Michael P.
Kittle John E.
Owens Terry J.
LandOfFree
Plasma CVD apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma CVD apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma CVD apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1279433