Glass manufacturing – Processes – Forming product or preform from molten glass
Patent
1992-06-09
1993-03-30
Lindsay, Robert L.
Glass manufacturing
Processes
Forming product or preform from molten glass
65 314, 65 315, 65 42, 65 602, 65 31, 427163, 385130, 156654, C03C 2502, G02B 612
Patent
active
051980088
ABSTRACT:
An optical interconnect structure, formed on a substrate, optically interconnects optoelectronic transmitting and receiving devices. The optical interconnect structure includes optical interconnects each of which includes a core member constructed of a material having a first predetermined index of refraction. The ends of the core members are chemically bonded either to an optoelectronic device or a core member of another optical interconnect. A cladding layer surrounds each core member. Each end of a cladding layer proximate to an optoelectronic device is chemically bonded to that device. The cladding layer is formed of a material having a second predetermined index of refraction, the magnitude of which is less than the magnitude of the first predetermined index of refraction.
REFERENCES:
patent: 4221047 (1980-09-01), Narken et al.
patent: 4693543 (1987-09-01), Matsumura et al.
patent: 4730330 (1988-03-01), Plihal et al.
patent: 4756734 (1988-07-01), Kersten et al.
patent: 4760568 (1988-04-01), Hine
patent: 4861126 (1989-08-01), Dautartas et al.
patent: 4901321 (1990-02-01), Blondeaux et al.
patent: 4919507 (1990-04-01), Evans et al.
patent: 4950044 (1990-08-01), Makita
patent: 4979970 (1990-12-01), Dannoux et al.
patent: 4989934 (1991-02-01), Zavracky et al.
patent: 5057135 (1991-10-01), Maruyama et al.
patent: 5116704 (1992-05-01), Kwon
"Optical Fiber--The Expanding Medium", Susanne R. Nagel, IEEE Circuits and Devices Magazine, Mar., 1989, pp. 36-45.
"Major Initiatives for Optical Computing", John A. Neff, Optical Engineering, Jan., 1989, vol. 26, No. 1, pp. 2-9.
"Optical Interconnect for Wafer-Scale Silicon Systems", Jeff Fried et al., Proceedings of Jun. 21-22, 1984 V-MIC Conf., pp. 159-166.
"Survey of Silicon-Based Integrated Opticals", Dennis G. Hall, IEEE Computer, Dec., 1987, pp. 25-32.
Text Book entitled "Electromagnetics", Third Edition, John D. Kraus, McGraw-Hill Book Company, New York, specifically section 13-15, pp. 593-597 no date.
Text Book entitled "Modern Optical Engineering", Warren J. Smith, McGraw-Hill Book Company, particularly section 9-8, pp., 236-239 no date.
"Overview of Optical Interconnections", Fred J. Leonberger et al., Proceedings of the Technical Conference, Fifth Annual International Electronics Packaging conference, Oct. 21-23, 1985, Orlando, Fla., pp. 334-342.
"Optical Interconnections Between Integrated Circuit Chips", John A. Neff, Proceedings of the Technical Packaging Conference, Fifth Annual International Electronics Packaging Conference, Oct. 21-23, 1985, Orlando, Fla., pp. 343-350.
Lindsay Robert L.
Murray William H.
National Semiconductor Corporation
Rappaport Irving S.
Robinson Stephen R.
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