Metal fusion bonding – Process – Using only pressure
Patent
1992-03-27
1993-03-30
Seidel, Richard K.
Metal fusion bonding
Process
Using only pressure
228124, 228205, B23K 2002, B23K 2024
Patent
active
051976536
ABSTRACT:
Two articles are provided with mounting surfaces which are to be joined together. A ring shaped preform is selected which consists substantially of indium. The preform is placed on a plate like support means having a plurality of flow through apertures such that the apertures are located to be in alignment with and under at least portions of the preform to permit the passage of cleaning agents through the apertures and around at least selected portions of the preform. A motion limiting means is coupled to the support means so as to serve to limit motion of the preform, bounded by the support means and the motion limiting means. With the motion limiting means in place, the combination of the motion limiting means and the support means can be handled without any contact with the preform.
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Toshiba Glass-Sealed He-Ne Laser Tubes; by T. Shimada, T. Kaneko and S. Katagiri; Toshiba Review, #105, Sep.-Oct. 1976, pp. 40-43.
Beckwith Timothy A.
Podgorski Theodore J.
Elpel Jeanne M.
Honeywell Inc.
Pajak Robert A.
Seidel Richard K.
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