Mounting structure of flat-lead package-type electronic componen

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

174 52FP, 357 70, H01L 2302

Patent

active

047033932

ABSTRACT:
A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.

REFERENCES:
patent: 3588618 (1971-06-01), Otte

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