Thermal measuring and testing – Thermal testing of a nonthermal quantity – Of fluid volume
Patent
1987-03-19
1989-06-13
Cuchlinski, Jr., William A.
Thermal measuring and testing
Thermal testing of a nonthermal quantity
Of fluid volume
374 33, 73 19, G01N 2500, G01N 716
Patent
active
048387061
ABSTRACT:
A method and apparatus for thermal analysis of a solid or liquid sample which evolves or absorbs gas on heating or cooling, wherein the sample is heated or cooled in an enclosed space, the temperature of the sample and the pressure of the gas are continuously monitored by temperature and pressure sensors respectively, and measurements of sample temperature and gas pressure are input to a data processor which also controls the temperature change of the sample. The value of gas pressure as a function of sample temperature and the rate of change of this value with respect to sample temperature are calculated; these functions are characteristic of the sample or of a component of the sample under analysis.
REFERENCES:
patent: 2387878 (1945-10-01), Brown
patent: 2414364 (1947-01-01), Dietrert et al.
patent: 3490266 (1970-01-01), Bennett et al.
patent: 3564901 (1971-02-01), Megrue
patent: 3578404 (1971-05-01), Walles et al.
patent: 3589172 (1971-06-01), Bowman
patent: 3593564 (1971-07-01), Kraus
patent: 3659452 (1972-05-01), Atwood et al.
patent: 3681026 (1972-08-01), Holden
patent: 3812705 (1974-05-01), Boillot
patent: 4072050 (1978-02-01), Ter-Minassian
patent: 4314969 (1982-02-01), Arthur et al.
Ryan, D. H. et al., "Thermopiezic analysis: gas absorption and desorption studies on milligram samples", J. Phys. E: Sci. Instrum. 19 (1986), pp. 693-694.
"An Automatic Thermomanometer for Hydrogen Absorption and Desorption Studies on Milligram Samples", Surface and Coatings Technology, 28 (1986), pp. 383-386.
Coey John M. D.
Ryan Dominic H.
Cuchlinski Jr. William A.
The Provost Fellows and Scholars of the College of the Holy and
Will Thomas B.
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