Metal fusion bonding – Process – Plural joints
Patent
1987-11-12
1989-06-13
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228240, 228221, 219275, 432 13, 432152, 134107, 134108, B23K 112, H05K 334
Patent
active
048384763
ABSTRACT:
A process for treating workpieces in a normally closed treatment chamber. The process comprises providing a pressure within the chamber which is less than atmospheric and providing an unsaturated treatment vapor within the chamber. A workpiece is then moved into the chamber to be treated by the unsaturated vapor. The process is particularly suited for the vapor phase soldering of printed circuit boards. The unsaturated vapor in the chamber is heated to a temperature higher than the melting point of the solder used and the circuit boards with solder thereon are passed through the vapor in the chamber to reflow the solder.
The invention is also directed toward an apparatus for carrying out the process.
REFERENCES:
patent: 3025533 (1962-03-01), Hair
patent: 4077467 (1978-03-01), Spigarelli
patent: 4264299 (1981-04-01), Ammann et al.
patent: 4321031 (1982-03-01), Woodgate
patent: 4392049 (1983-07-01), Bentley et al.
patent: 4676069 (1987-06-01), Miyate
patent: 4747218 (1988-05-01), Saint Martin
Brown Charles A.
Brown Charles E.
Fluocon Technologies Inc.
Ramsey Kenneth J.
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