Method of manufacturing a printed circuit board

Details Method of manufacturing a printed circuit board Method of manufacturing a printed circuit board

1993-08-04

1994-10-25

Vo, Peter Dungba

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29830, H05K 336, H05K 340

Patent

active

053576748

ABSTRACT:
A method of manufacturing a printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent.

REFERENCES:
patent: 4393581 (1983-07-01), Cherian
patent: 4649461 (1987-03-01), Matsuta
patent: 4683653 (1987-08-01), Iwasa
patent: 4725920 (1988-02-01), Ijichi et al.
patent: 4763188 (1988-08-01), Johnson
patent: 4908933 (1990-03-01), Sagisaka et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-126941