Semiconductor pressure sensor

Measuring and testing – Fluid pressure gauge – Diaphragm

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Details

73115, 73721, 73756, 338 4, G01L 708, G01L 906

Patent

active

048380890

ABSTRACT:
The semiconductor pressure sensor embodying the present invention comprises a housing. A sensor board is located in this housing. A pressure-sensing chip, which is formed of a semiconductor and capable of measuring the pressure of a pressure medium, is mounted on the sensor board. Another semiconductor chip, which operates in cooperation with the pressure-sensing chip, is also mounted on the sensor board. A shielding member is located in the housing. This shielding member encloses the pressure-sensing chip in such a manner that the pressure-sensing chip is isolated from the semiconductor chip, and defines a storage chamber which is airtight from the other regions in the housing and adapted to store the pressure-sensing chip. The interior of the housing, except for the storage chamber, is filled with filler, so as to protect the semiconductor chip.

REFERENCES:
patent: 4295117 (1981-10-01), Lake et al.
patent: 4413527 (1983-11-01), Sugiura et al.

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