Reversible production process for assembly of circuit board and

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29827, 29832, 29841, 428901, 257753, 257758, H05K 334

Patent

active

051828529

ABSTRACT:
Production process for the reversible assembly of an electronic read and/or operating circuit board having a front face with conductive tracks and a rear face which is metallized and an electrically conductive or nonconductive support or substrate which may include metallized conductive tracks. The assembly is achieved by use of an electrically insulating silicone adhesive layer. A conductive foil is interposed between the rear face of the circuit board and the adhesive layer and is connected to a terminal in the support.

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patent: 3906144 (1975-09-01), Wiley
patent: 3993800 (1976-11-01), Callender
patent: 4479367 (1984-10-01), Buller
patent: 4812420 (1989-03-01), Matsuda et al.
patent: 5002818 (1991-03-01), Licari et al.
patent: 5089878 (1992-02-01), Lee

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