Mounting substrate

Details Mounting substrate Mounting substrate

1991-02-25

1994-09-27

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174264, 361784, H05K 100

Patent

active

053508866

ABSTRACT:
An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

REFERENCES:
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4368503 (1983-01-01), Kurosawa et al.
patent: 4628407 (1986-12-01), August et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4692843 (1987-09-01), Matsumoto et al.
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4899439 (1990-02-01), Potter et al.
patent: 5072075 (1991-12-01), Lee et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5089880 (1992-02-01), Meyer et al.

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