Design and sealing method for semiconductor packages

Details Design and sealing method for semiconductor packages Design and sealing method for semiconductor packages

1992-09-10

1994-09-27

Thomas, Tom

Fishing, trapping, and vermin destroying

437209, 437214, 437215, 437218, H01L 2160

Patent

active

053507134

ABSTRACT:
Several methods of forming an integrated circuit package by ultrasonically welding a thermal plastic material which joins two housing portions together in such a fashion as to seal an integrated circuit within the two housing portions is described along with the resulting structures of those methods.

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patent: 5106785 (1992-04-01), Rauchmaul et al.
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