Electronic hybrid circuit package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

357 74, H05K 500

Patent

active

042726441

ABSTRACT:
A hybrid package which includes a plastic shell having an integral interior configuration for support of a ceramic substrate and terminal pins, and an encapsulate for rigid retention of the pins and for sealing of the package.

REFERENCES:
patent: 3501582 (1970-03-01), Heidler et al.
patent: 3689684 (1972-09-01), Cox et al.
patent: 3721747 (1973-03-01), Renskers
patent: 3737729 (1973-06-01), Carney

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