Plasma passivation technique for the prevention of post-etch cor

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

156643, 156646, 156665, 204164, 204192EC, 204192E, 427309, B05D 304, B05D 306

Patent

active

043259847

ABSTRACT:
A method for preventing the post-etch corrosion of aluminum or aluminum alloy film which has been etched utilizing chlorinated plasma wherein the etched film is exposed to fluorinated plasma.

REFERENCES:
patent: 4267013 (1981-05-01), Iida et al.

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