Patent
1988-01-26
1989-08-15
Hille, Rolf
357 55, 357 20, H01L 2714
Patent
active
048579807
ABSTRACT:
A radiation-sensitive semiconductor device has a high-ohmic semiconductor wafer with a thicker edge portion and a thinner central portion, in which a photodiode is located. The surface opposite to the photodiode is provided with a highly-doped contact layer, on which a metal layer is provided. The central portion is so thin that at a low photodiode voltage the depletion zone of the photodiode extends as far as the contact layer. According to the invention, the device includes an active screening diode, which extends both in the edge portion and in the central portion and whose depletion zone extends in the operating condition in the central portion as far as the contact layer. As a result, diffusion of charge carriers from the edge portion to the photodiode is avoided.
REFERENCES:
patent: 3081418 (1963-03-01), Manintveld et al.
patent: 3296502 (1967-01-01), Gross et al.
patent: 3716429 (1973-02-01), Napoli et al.
patent: 3794891 (1974-02-01), Takamiya
Biren Steven R.
Hille Rolf
Mintel William
U.S. Philips Corp.
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