Method of manufacturing automobile AC generator and method of ma

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

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310 64, 310 68D, 29829, 29831, H01L 2144, H01L 2150, H05K 300, H02K 1100, H02K 132

Patent

active

061501964

ABSTRACT:
First, a rectifier assembly is assembled from a negative heat sink assembly, a positive heat sink assembly, a circuit board assembly, and a guide. Subsequently, stator coil connecting terminals of the rectifier assembly are chucked by using a grounded chucking jig. Then, under this condition, powder coating charged with a plus polarity is sprayed to this rectifier assembly, and thus the sprayed powder coating is absorbed onto a surface of an exposed metal of the rectifier assembly by the electrostatic force. Thereafter, a heating process operation is carried out to heat/harden this powder coating, so that the insulating film is formed on the surface of the exposed metal of the rectifier assembly.

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patent: 5821674 (1998-10-01), Weiner
patent: 5846852 (1998-12-01), Limper-Brenner et al.
patent: 5977669 (1999-11-01), Yoshida et al.

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