Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1998-08-20
2000-11-21
Booth, Richard
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
310 64, 310 68D, 29829, 29831, H01L 2144, H01L 2150, H05K 300, H02K 1100, H02K 132
Patent
active
061501964
ABSTRACT:
First, a rectifier assembly is assembled from a negative heat sink assembly, a positive heat sink assembly, a circuit board assembly, and a guide. Subsequently, stator coil connecting terminals of the rectifier assembly are chucked by using a grounded chucking jig. Then, under this condition, powder coating charged with a plus polarity is sprayed to this rectifier assembly, and thus the sprayed powder coating is absorbed onto a surface of an exposed metal of the rectifier assembly by the electrostatic force. Thereafter, a heating process operation is carried out to heat/harden this powder coating, so that the insulating film is formed on the surface of the exposed metal of the rectifier assembly.
REFERENCES:
patent: 4668898 (1987-05-01), Harms et al.
patent: 5095235 (1992-03-01), Kitamura
patent: 5258673 (1993-11-01), Gotoh
patent: 5686780 (1997-11-01), Adachi et al.
patent: 5729063 (1998-03-01), Adachi et al.
patent: 5821674 (1998-10-01), Weiner
patent: 5846852 (1998-12-01), Limper-Brenner et al.
patent: 5977669 (1999-11-01), Yoshida et al.
Adachi Katsumi
Higashino Kyoko
Tanaka Kazunori
Booth Richard
Mitsubishi Denki & Kabushiki Kaisha
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