Method for an integrated circuit thermal grease mesh structure

Details Method for an integrated circuit thermal grease mesh structure Method for an integrated circuit thermal grease mesh structure

1999-07-16

2000-11-21

Guay, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438122, H01L 2148

Patent

active

061501956

ABSTRACT:
The invention includes a method for assembling an integrated circuit package. In the method, a substrate is presented. Next, an integrated circuit may be mounted to the substrate. A retaining structure is presented that is shaped as a mesh that is at least one of a hexagonal mesh, a triangular mesh, and an irregular shaped mesh. The retaining structure is then impregnated with a thermal grease to form a heat pipe. The heat pipe is trimmed to the perimeter of the top surface so that the heat pipe does not extend into the at least one corner of the top surface. The heat pipe is placed on the top surface of the integrated circuit. A thermal element is then placed on the impregnated retaining structure.

REFERENCES:
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patent: 4295151 (1981-10-01), Nyul et al.
patent: 4384610 (1983-05-01), Cook et al.
patent: 4446916 (1984-05-01), Hayes
patent: 4482912 (1984-11-01), Chiba et al.
patent: 5323294 (1994-06-01), Layton et al.
patent: 5459352 (1995-10-01), Layton et al.
patent: 5783862 (1998-07-01), Deeney
patent: 6037658 (2000-03-01), Brodsky et al.

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