Fabrication process for MOSFET using oblique rotation ion implan

Fishing – trapping – and vermin destroying

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437 35, 437953, H01L 21265

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057364168

ABSTRACT:
A P-type diffusion layer for buried channel is formed on the surface of N-well immediately below a gate electrode, then a side wall spacer is formed at the side surface of the gate electrode. Subsequently, with taking the gate electrode and the side wall spacer as mask, phosphorous ion is implanted to the N-well by oblique rotating ion implantation and boron fluoride ion is implanted by perpendicular ion implantation. Then, phosphorous ion and boron fluoride ion are activated by heat treatment to form high density P-type diffusion layer and P-type diffusion layer for buried channel.

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