Patent
1991-04-16
1992-08-18
Mintel, William
357 19, 357 72, 357 74, 357 75, H01L 3300
Patent
active
051403846
ABSTRACT:
The present invention provides a semiconductor laser device which comprises a stem, a cap mounted to the stem, and a semiconductor laser chip carried by the stem within the cap. The laser chip is covered by a protective body which is made of a transparent synthetic resin, preferably a relatively soft resin such as silicone resin. The protective body prevents the laser chip from being adversely affected by moisture and/or dust even if external air gets into the cap. The protective body may be further covered by a second protective body which is made of a relatively hard resin such as epoxy resin.
REFERENCES:
patent: 4432131 (1984-02-01), Sadamasa et al.
patent: 4768070 (1988-08-01), Takizawa et al.
patent: 4945391 (1990-07-01), Yagoura et al.
Dion et al., "Module Package", IBM Technical Disclosure Bulletin, vol. 7, No. 7, Dec. 1964, p. 55.
Eilberg William H.
Mintel William
Rohm & Co., Ltd.
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