Ceramic base component packaging assembly

Details Ceramic base component packaging assembly Ceramic base component packaging assembly

1990-09-04

1992-08-18

Lateef, Marvin M.

Electrical resistors

Incased, embedded, or housed

338252, 338254, 338232, 338277, 338315, 174 521, H01C 102

Patent

active

051402980

ABSTRACT:
A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device.

REFERENCES:
patent: 4728779 (1988-03-01), Kotani et al.
patent: 4814584 (1989-03-01), Bohlender et al.
patent: 4870249 (1989-09-01), Kayanuma et al.
patent: 4894637 (1990-01-01), Yamada et al.

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