Methods for simultaneously electrically and mechanically attachi

Details Methods for simultaneously electrically and mechanically attachi Methods for simultaneously electrically and mechanically attachi

1998-09-03

2000-08-29

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438123, 438453, H01L 2144

Patent

active

061107611

ABSTRACT:
Methods for applying an adhesive material to a semiconductor connection component and the resulting structures. The method is practiced by providing a flowable adhesive material, providing a semiconductor connection component having a first portion horizontally offset from a second portion, and contacting the first portion of the semiconductor connection component with the adhesive material so a portion of the adhesive material attaches to the first portion. The semiconductor connection component may be a lead frame element having a lead finger. The adhesive material is an electrically conductive material. The first portion of the semiconductor connection component may also be vertically offset from the second portion. The semiconductor connection component with the adhesive material attached to the first portion thereof may then be contacted with a surface of a semiconductor die to attach the component to the die. By applying the adhesive material only to the first portion, the adhesive material is precisely applied in a simple manner, little adhesive material is washed, and a one-step electrical/mechanical connection to bond pads of the die is provided.

REFERENCES:
patent: Re35027 (1995-08-01), Ragard
patent: 4045863 (1977-09-01), Mitterhummer et al.
patent: 4346124 (1982-08-01), Wood et al.
patent: 4355463 (1982-10-01), Burns
patent: 4687693 (1987-08-01), Sheyon et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4876221 (1989-10-01), Hatada
patent: 4959008 (1990-09-01), Wasulko
patent: 5030308 (1991-07-01), Sheyon et al.
patent: 5049434 (1991-09-01), Wasulko
patent: 5066614 (1991-11-01), Dunaway et al.
patent: 5139973 (1992-08-01), Nagy et al.
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5286679 (1994-02-01), Farnsworth et al.
patent: 5302849 (1994-04-01), Cavasin
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5409863 (1995-04-01), Newman
patent: 5482739 (1996-01-01), Glenn et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5563443 (1996-10-01), Beng et al.
patent: 5585282 (1996-12-01), Wood et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5733800 (1998-03-01), Moden
patent: 5739053 (1998-04-01), Kawakita et al.
patent: 5773322 (1998-06-01), Weld
patent: 5810926 (1998-09-01), Evers
patent: 5834062 (1998-11-01), Johnson et al.
patent: 5897339 (1999-04-01), Song et al.
patent: 5923957 (1999-07-01), Song et al.

Affiliated with

Also associated with

Rating

Methods for simultaneously electrically and mechanically attachi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for simultaneously electrically and mechanically attachi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for simultaneously electrically and mechanically attachi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1249055