Method for making a semiconductor package with the distance betw

Details Method for making a semiconductor package with the distance betw Method for making a semiconductor package with the distance betw

1990-12-17

1992-08-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, 437220, 437902, H01L 2156, H01L 2158, H01L 2160

Patent

active

051399733

ABSTRACT:
A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the local portion of the lead frame having been bonded in the stack is then put into a mold and the stack assembly encapsulated in a thermosetting resin to produce the semiconductor package.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4396936 (1983-08-01), McIver et al.
patent: 4594770 (1986-06-01), Butt
patent: 5041902 (1991-08-01), McShane
IBM Technical Disclosure Bulletin; vol. 25, No. 4, Sep. 1982, Edwards.
IBM Technical Disclosure Bulletin; vol. 15, No. 1, Jun. 1972, Honn.

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