Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-04-22
2000-11-21
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
29840, 29843, H05K 330
Patent
active
061485128
ABSTRACT:
A method for attaching a flip chip or other microelectronic device to a circuit board or other substrate. The method entails the forming of recesses having precise volumes above and surrounding each terminal pad so as to enable the deposition on each pad of a controlled volume of conductive material, such that reduced spacing between terminals can be enabled. If a conductive adhesive is used as the conductive material, the method drastically reduces the likelihood that an inadequate amount of adhesive will be deposited, while excess adhesive can be accommodated without causing shorting between adjacent terminals. If flip chip attachment is achieved with a solder composition, the method eliminates the prior art requirement for circuit board terminal bumping and bump flattening.
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Fekete Douglas D.
Motorola Inc.
Young Lee
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