Dry etching apparatus

Details Dry etching apparatus Dry etching apparatus

1990-06-15

1992-04-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 156646, 20429835, 20429836, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

051085356

ABSTRACT:
A dry etching apparatus includes a discharge room in which a gas plasma is created by a discharge, an ejection nozzle for ejecting the plasma gas, a first vacuum room into which the plasma gas is introduced through the ejecting nozzle by supersonic expansion of the plasma gas, and a second vacuum room including a skimmer for extracting a supersonic molecular flow, the supersonic molecular flow of the plasma gas taken into the second vacuum room being blown against the material to be etched.

REFERENCES:
Suzuki et al., "Anisotropic Etching . . . Beam", Journal of Applied Physics 64 (7), Oct. 1988, pp. 3697-3705.
Geis et al., "Hot-Jet Etching . . . Si", Journal of Vacuum Science Technology B5(1), 1987, pp. 363-365.

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