Polishing member and wafer polishing apparatus

Details Polishing member and wafer polishing apparatus Polishing member and wafer polishing apparatus

1994-12-09

1996-10-15

Meislin, D. S.

Abrading

Machine

Rotary tool

451285, 451526, 451533, B24B 500

Patent

active

055649653

ABSTRACT:
A polishing apparatus is provided which can effect surface-based polishing of a wafer without causing the wafer to produce an undulation or peripheral protrusion. A sheetlike polishing member 5 constructed by superposing a foam sheet 2 containing minute closed cells in a web of chloroprene rubber and a velour type non-woven fabric (polishing cloth 3) is attached fast to the surface of a polishing table 1. The polishing member is capable of polishing a given wafer while maintaining the uniformity of thickness of the wafer or an oxide film formed on the surface of the wafer because, during the application of pressure by a pressing member 14, the polishing pressure is uniformly distributed throughout the entire rear surface of the wafer and the polishing member is bent in conformity with the global rises and falls in the wafer surface.

REFERENCES:
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5257478 (1993-11-01), Hyde et al.
Patent Abstracts of Japan, v14,n502,E-0997, Aug. 20, 1990, Hitachi Cable Ltd.
Patent Abstracts of Japan, v11,n398,C-466, Jul. 11, 1987, Kanebo, Ltd.
Patent Abstracts of Japan, v8,n107,E-245, Feb. 4, 1984, Nippon Denki KK.

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