Method of manufacturing an electronic component

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29840, 257712, 361792, 361796, H05K 336

Patent

active

058602100

ABSTRACT:
An electronic component includes a substrate (11) having a device surface (13) and opposite ends (14, 15) adjacent to the device surface (13), an electronic device (16) supported by the device surface (13), and an interconnect substrate (30) overlying a first end (14) of the substrate (11) and electrically coupled to the electronic device (16). The electronic component can be manufactured by inserting the second end (15) of the substrate (11) into one of a plurality of holes (23) in a carrier (20) wherein the device surface (13) and the carrier (20) form an angle greater than approximately five degrees.

REFERENCES:
patent: 4294007 (1981-10-01), Ellis, Jr.
patent: 4502098 (1985-02-01), Brown et al.
patent: 4823233 (1989-04-01), Brown et al.
patent: 4868712 (1989-09-01), Woodman
patent: 5172303 (1992-12-01), Bernardone et al.
patent: 5220198 (1993-06-01), Tsuji
patent: 5279029 (1994-01-01), Burns
patent: 5352851 (1994-10-01), Wallace et al.
patent: 5604377 (1997-02-01), Palagonia

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