Resin reclamation in carpet manufacture

Details Resin reclamation in carpet manufacture Resin reclamation in carpet manufacture

1976-04-07

1977-06-07

Whitby, Edward G.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156334, 260 23, 264 37, 427345, B32B 3500

Patent

active

040281590

ABSTRACT:
Selvedge from carpeting containing meltable resin content is heated to melt and degrade said resin which is then separated by screening or straining from any solid residue. As an example, tufted carpeting having nylon yarn pile secured in a woven polypropylene primary back which is bonded by a thermoplastic adhesive to the pile yarns and to a secondary back of woven jute is so treated to separate a significant quantity of the resin from the jute. The jute residue may be incinerated to utilize the latent thermal energy therein. Alternatively, the secondary back may be of thermoplastic material or may be omitted. The reclaimed degraded resin is then substituted for the high molecular weight copolymer which constitutes a component of the adhesive for subsequent carpet manufacture.
The process may be carried out in a double-walled vessel wherein the inner wall is pervious or it can be carried out with apparatus having a moving web of pervious material for supporting the selvedge or the like.

REFERENCES:
patent: 3684600 (1972-08-01), Smedberg
patent: 3857799 (1974-12-01), Ooba et al.
patent: 3923653 (1975-12-01), Lavins
patent: 3941066 (1976-03-01), Itoh et al.
patent: 3956414 (1976-05-01), Oshima

Affiliated with

Also associated with

Rating

Resin reclamation in carpet manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin reclamation in carpet manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin reclamation in carpet manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1235397