Semiconductor device with improved bond pads

Details Semiconductor device with improved bond pads Semiconductor device with improved bond pads

1995-12-21

1997-11-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257784, 257786, H01L 2348

Patent

active

056867620

ABSTRACT:
A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of the bond pads. The opening(s) may include recesses extending partially into the bonding surface or channels that extend entirely through the bond pads. Various shapes and configurations of the openings may be used, such as a pattern of channels radiating from the center of the bonding surface, a series of spaced apart rectangular channels arranged parallel to one another, an array of L shaped channels arranged around the center of the bonding surface, or an array of holes.

REFERENCES:
patent: 5053850 (1991-10-01), Baker et al.
patent: 5248903 (1993-09-01), Heim
patent: 5373111 (1994-12-01), McClure et al.

Affiliated with

Also associated with

Rating

Semiconductor device with improved bond pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device with improved bond pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device with improved bond pads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1231502