Method of manufacturing a semiconductor integrated circuit devic

Details Method of manufacturing a semiconductor integrated circuit devic Method of manufacturing a semiconductor integrated circuit devic

1995-04-28

1997-11-11

Tsai, Jey

Fishing, trapping, and vermin destroying

437205, 257676, H01L 2160

Patent

active

056863624

ABSTRACT:
A single semiconductor chip containing a control portion and a power portion including a power element associated with the control portion and a concave portion formed between the control portion and the power portion is mounted on a die pad so as to separate the control portion and the power portion. The die pad has a convex portion which is received in the concave portion and the semiconductor chip is divided to separate the control portion and the power portion by applying pressure to the chip or by applying laser beams, and the separated semiconductor chip portions are simultaneously bonded to the die pad.

REFERENCES:
patent: 4797726 (1989-01-01), Manabe

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