Depositing and densifying glass to planarize layers in semi-cond

Details Depositing and densifying glass to planarize layers in semi-cond Depositing and densifying glass to planarize layers in semi-cond

1994-07-21

1996-05-07

Dang, Thi

Fishing, trapping, and vermin destroying

437195, 437228, 437231, 437235, 437238, 437978, 1566361, 1566261, 1566571, H01L 21265, H01L 21316

Patent

active

055146163

ABSTRACT:
Methods of planarizing one or more layers having an irregular top surface topology in a semiconductor device based on an underlying MOS structure are disclosed. Methods of creating doped wells or regions for the underlying MOS structure are also disclosed, using thick oxide growths on the surface of the substrate to mask implantation of ions into the wells. A technique for creating a pair of adjacent complementary oppositely-doped wells, such as for a CMOS structure, using a thick oxide growths as a mask is also disclosed. One of the methods of planarizing the one or more layers involves depositing, densifying and re-flowing a layer of glass on top of the topological layer. Another method of planarizing the one or more layers involves depositing, densifying and chemical-mechanically polishing the deposited and densified glass, thereby avoiding an additional temperature cycle (i.e., for re-flowing the glass) which would adversely affect underlying diffusions.

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