Method for laser functional trimming of films and devices

Details Method for laser functional trimming of films and devices Method for laser functional trimming of films and devices

1995-10-02

1997-11-11

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

437173, B23K 2600, H01L 21428

Patent

active

056859953

ABSTRACT:
A laser system (50) and processing method exploit a wavelength range (40) in which devices, including any semiconductor material-based devices (10) affected by conventional laser wavelengths and devices having light-sensitive or photo-electronic portions integrated into their circuits, can be effectively functionally trimmed without inducing performance drift or malfunctions in the processed devices. True measurement values of operational parameters of the devices can, therefore, be obtained without delay for device recovery, i.e., can be obtained substantially instantaneously with laser impingement. Accordingly, the present invention allows faster functional laser processing, eases geometric restrictions on circuit design, and facilitates production of denser and smaller devices.

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