Method of making a transistor device

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29583, 148186, H01L 2122

Patent

active

040408779

ABSTRACT:
A plurality of discrete transistor devices are produced on a semiconductor wafer and isolated from one another by moat etching. A passivation layer is then deposited in the moats separating the discrete transistor devices. The semiconductor wafer is then scribed and broken along lines delineated by the moats. The disclosed method permits testing of each discrete transistor device prior to separation from the wafer.

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patent: 3943013 (1976-03-01), Kennedy et al.
patent: 3975221 (1976-08-01), Rodgers

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