Integrated circuit probing method

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

3241581, G01R 1073

Patent

active

059906944

ABSTRACT:
A circuit probing method includes contacting a conductive probe with a contact pad of an electronic circuit. An electric signal is sent between the contacted probe and the contact pad. After sending the signal, the conductive probe and contact pad are removed from contacting one another. After the removing, the conductive probe is chemically cleaned. In a further aspect, an integrated circuit on a semiconductor substrate has at least one conductive contact pad. A circuit probe formed from a semiconductor wafer has at least one conductive projecting apex. The conductive apex is brought into contact with the contact pad. An electric signal is sent between the contacted contact pad and the projecting apex. After sending the signal, the apex and contact pad are removed from contacting one another. After the removing, the conductive apex of the circuit probe is chemically cleaned. After the chemical cleaning, the conductive apex is contacted with another contact pad of another integrated circuit formed on another semiconductor substrate, and an electric signal is sent therebetween.

REFERENCES:
patent: 3628144 (1971-12-01), Aronstein
patent: 4590422 (1986-05-01), Milligan
patent: 5220279 (1993-06-01), Nagasawa
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5478779 (1995-12-01), Akram
patent: 5652428 (1997-07-01), Nishioka et al.
patent: 5666063 (1997-09-01), Abercrombie et al.

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